POLYIMIDE-BASED POLYMER THICK FILM COMPOSITIONS

• Main Authors: HAIXIN YANG, SEIGI SUH
• Format: Patent
• Language: Chinese; English
• Published: 30.06.2017
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CONDUCTORS; CORRECTING FLUIDS; DYES; ELECTRICITY; FILLING PASTES; INKS; INSULATORS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS THEREFOR; WOODSTAINS

This invention is directed to polyimide-based polymer thick film compositions and particularly non-fluorinated polyimide-based polymer thick film compositions. These compositions are comprised of certain polyimide polymers and certain solvents. In some embodiments various functional components are added to the composition to provide compositions that can be used to form various electrical circuit elements. 本发明题为"基于聚酰亚胺的聚合物厚膜组合物"。本发明涉及基于聚酰亚胺的聚合物厚膜组合物，尤其是非氟化的基于聚酰亚胺的聚合物厚膜组合物。这些组合物由某些聚酰亚胺聚合物和某些溶剂组成。在些实施方案中，将各种功能组分添加至所述组合物，从而得到可用于形成各种电路元件的组合物。