Visible light sensor

The invention provides a visible light sensor comprising a wafer and a packaging unit coating the periphery of the wafer. A photosensitive circuit is processed on the wafer. The packaging unit is made of a light-transmittable high molecular material; and infrared ultraviolet cut-off colouring agent...

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Bibliographic Details
Main Author HE GUANJUN
Format Patent
LanguageChinese
English
Published 22.03.2017
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Summary:The invention provides a visible light sensor comprising a wafer and a packaging unit coating the periphery of the wafer. A photosensitive circuit is processed on the wafer. The packaging unit is made of a light-transmittable high molecular material; and infrared ultraviolet cut-off colouring agent with the mass ratio of 1% to 5%, liquid bisphenol A type epoxy resin with the mass ratio of 45% to 49%, and liquid anhydride type curing agent with the mass ratio of 50% are stirred uniformly at a normal temperature to prepare the light-transmittable high molecular material. The photosensitive circuit includes two photodiodes, an operational amplifier and a filter. Light passes through the light-transmittable high molecular material and thus infrared light and ultraviolet light are filtered; visible light passing through the light-transmittable high molecular material irradiates the photodiodes of the wafer; the photodiodes form unidirectional voltages; and after amplification by the operational amplifier and filte
Bibliography:Application Number: CN20161868664