Backing plate for drilling of PCB (printed circuit board) and preparation method of backing plate

The invention discloses a backing plate for drilling of a PCB (printed circuit board) and a preparation method of the backing plate. The backing plate comprises a wood fiber plate as well as ultraviolet radiation cured resin layers applied to the upper surface and the lower surface of the wood fiber...

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Main Authors WEI MEIXIAO, LIU FEI, TANG JIALIN, ZHANG LUNQIANG
Format Patent
LanguageChinese
English
Published 20.04.2016
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Abstract The invention discloses a backing plate for drilling of a PCB (printed circuit board) and a preparation method of the backing plate. The backing plate comprises a wood fiber plate as well as ultraviolet radiation cured resin layers applied to the upper surface and the lower surface of the wood fiber plate, wherein the ultraviolet radiation cured resin layers have the performance of radiation curing through ultraviolet radiation curing LED lamps. The backing plate obtained after ultraviolet radiation curing by the ultraviolet radiation curing LED lamps has the advantages of smaller warp deformation, higher smoothness, more easily acceptable appearance, extremely light odor, higher hardness, long service life and environmental protection. Besides, a heat dissipation device is arranged on a conveying device, so that the heat influence on the backing plate in a preparation process can be reduced effectively, the warp degree of the backing plate is further reduced, and the smoothness of the backing plate is furthe
AbstractList The invention discloses a backing plate for drilling of a PCB (printed circuit board) and a preparation method of the backing plate. The backing plate comprises a wood fiber plate as well as ultraviolet radiation cured resin layers applied to the upper surface and the lower surface of the wood fiber plate, wherein the ultraviolet radiation cured resin layers have the performance of radiation curing through ultraviolet radiation curing LED lamps. The backing plate obtained after ultraviolet radiation curing by the ultraviolet radiation curing LED lamps has the advantages of smaller warp deformation, higher smoothness, more easily acceptable appearance, extremely light odor, higher hardness, long service life and environmental protection. Besides, a heat dissipation device is arranged on a conveying device, so that the heat influence on the backing plate in a preparation process can be reduced effectively, the warp degree of the backing plate is further reduced, and the smoothness of the backing plate is furthe
Author WEI MEIXIAO
ZHANG LUNQIANG
TANG JIALIN
LIU FEI
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RelatedCompanies SHENZHEN NEWCCESS INDUSTRIAL CO., LTD
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Snippet The invention discloses a backing plate for drilling of a PCB (printed circuit board) and a preparation method of the backing plate. The backing plate...
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SubjectTerms ADHESIVES
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
CORRECTING FLUIDS
DYES
FILLING PASTES
INKS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
POLISHES
USE OF MATERIALS THEREFOR
WOODSTAINS
Title Backing plate for drilling of PCB (printed circuit board) and preparation method of backing plate
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