Online gas phase cleaning apparatus and method capable of reducing GE short circuit in packaging IGBT (insulated gate bipolar transistor) power module
The invention provides an online gas phase cleaning apparatus and method capable of reducing GE short circuit in packaging an IGBT (insulated gate bipolar transistor) power module. The apparatus comprises a cleaning cavity; the cleaning cavity is formed on a feeding track for bonding and dispensing;...
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Format | Patent |
Language | English |
Published |
27.01.2016
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Subjects | |
Online Access | Get full text |
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Abstract | The invention provides an online gas phase cleaning apparatus and method capable of reducing GE short circuit in packaging an IGBT (insulated gate bipolar transistor) power module. The apparatus comprises a cleaning cavity; the cleaning cavity is formed on a feeding track for bonding and dispensing; the feeding track is used for transferring a chip; an air blowing pipeline and an air inhaling pipeline are arranged in the cleaning cavity; the air outlet of the air blowing pipeline is formed in the inclined upper part of at least one side of the chip; and the air inlet of the air inhaling pipeline is correspondingly formed in the inclined upper part, on the opposite side, of the chip. The online gas phase cleaning apparatus and method provided by the invention can clean the residual solder balls and aluminium skimmings on the surface of the chip after bonding leads and before dispensing, so as to prevent the metal residuals from being fixed in the position of the gate pole bus by the bonding glue to cause the GE failure of the chip, and so as to reduce the possibility of the GE short circuit. |
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AbstractList | The invention provides an online gas phase cleaning apparatus and method capable of reducing GE short circuit in packaging an IGBT (insulated gate bipolar transistor) power module. The apparatus comprises a cleaning cavity; the cleaning cavity is formed on a feeding track for bonding and dispensing; the feeding track is used for transferring a chip; an air blowing pipeline and an air inhaling pipeline are arranged in the cleaning cavity; the air outlet of the air blowing pipeline is formed in the inclined upper part of at least one side of the chip; and the air inlet of the air inhaling pipeline is correspondingly formed in the inclined upper part, on the opposite side, of the chip. The online gas phase cleaning apparatus and method provided by the invention can clean the residual solder balls and aluminium skimmings on the surface of the chip after bonding leads and before dispensing, so as to prevent the metal residuals from being fixed in the position of the gate pole bus by the bonding glue to cause the GE failure of the chip, and so as to reduce the possibility of the GE short circuit. |
Author | HE XINQIANG ZENG XIONG ZHOU ZHENG FENG HUIYU LI HAN HAN XINGYAO YAN FAN CHENG YU XU NINGHUA LI LIANGXING |
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Snippet | The invention provides an online gas phase cleaning apparatus and method capable of reducing GE short circuit in packaging an IGBT (insulated gate bipolar... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | Online gas phase cleaning apparatus and method capable of reducing GE short circuit in packaging IGBT (insulated gate bipolar transistor) power module |
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