Automatic chip separation and mounting method

• Main Authors: CHENG YU, XU NINGHUA, LI LIANGXING, ZENG XIONG, FENG HUIYU, HE XINQIANG, LI HAN
• Format: Patent
• Language: English
• Published: 06.01.2016
• Subjects: BASIC ELECTRIC ELEMENTS; CALCULATING; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PHYSICS; SEMICONDUCTOR DEVICES

Provided in the invention is an automatic chip separation and mounting method. The method comprises the following steps that: step A, initialization of a serial number m being equal to 0 and a chip level n being equal to 1 of a current product and a step B is carried out; step B, an nth-level chip o...