Automatic chip separation and mounting method

Provided in the invention is an automatic chip separation and mounting method. The method comprises the following steps that: step A, initialization of a serial number m being equal to 0 and a chip level n being equal to 1 of a current product and a step B is carried out; step B, an nth-level chip o...

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Bibliographic Details
Main Authors CHENG YU, XU NINGHUA, LI LIANGXING, ZENG XIONG, FENG HUIYU, HE XINQIANG, LI HAN
Format Patent
LanguageEnglish
Published 06.01.2016
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:Provided in the invention is an automatic chip separation and mounting method. The method comprises the following steps that: step A, initialization of a serial number m being equal to 0 and a chip level n being equal to 1 of a current product and a step B is carried out; step B, an nth-level chip on a wafer is picked up and is mounted to an m-th product and a step C is carried out; and step C, whether the nth-level chip is left on the wafer is determined; if so, 1 is added to the m and the step B is carried out; and if not, 1 is added to the n and the step B is carried out. According to the invention, with the method, level-to-level picking up of chips on the wafer is carried out and the chips are directly mounted on the product, thereby reducing operations of manual level classification, packaging, transporting, and splitting and the like of chips, reducing the manual intervention degree, saving the manpower and materials, and improving the production efficiency.
Bibliography:Application Number: CN20151657357