Cooling system and method for spray forming of silicon-aluminum alloy
The invention discloses a cooling system and method for spray forming of silicon-aluminum alloy. The system is composed of a first-level deposition surface cooling system and a second-level deposition room cooling system. The deposition surface cooling system comprises a gas supplying system, gas co...
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Format | Patent |
Language | English |
Published |
06.01.2016
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Abstract | The invention discloses a cooling system and method for spray forming of silicon-aluminum alloy. The system is composed of a first-level deposition surface cooling system and a second-level deposition room cooling system. The deposition surface cooling system comprises a gas supplying system, gas cooling devices and spraying pipes, wherein the gas supplying system, the gas cooling devices and the spraying pipes are connected in sequence through pipelines. The deposition room cooling system comprises heat sucking devices, a cooling device, a heat conduction medium inlet distribution pipeline and a heat conduction medium outlet gathering pipeline. According to the two-level cooling method, the problem that the temperature of a deposition room and the temperature of a deposition surface are too high in the spray forming process, and consequently the solidification velocity of silicon-aluminum particles is reduced is solved, and the defects that in the prior art, the cooling efficiency is low, and the deposition surface cannot be directly cooled are overcome. |
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AbstractList | The invention discloses a cooling system and method for spray forming of silicon-aluminum alloy. The system is composed of a first-level deposition surface cooling system and a second-level deposition room cooling system. The deposition surface cooling system comprises a gas supplying system, gas cooling devices and spraying pipes, wherein the gas supplying system, the gas cooling devices and the spraying pipes are connected in sequence through pipelines. The deposition room cooling system comprises heat sucking devices, a cooling device, a heat conduction medium inlet distribution pipeline and a heat conduction medium outlet gathering pipeline. According to the two-level cooling method, the problem that the temperature of a deposition room and the temperature of a deposition surface are too high in the spray forming process, and consequently the solidification velocity of silicon-aluminum particles is reduced is solved, and the defects that in the prior art, the cooling efficiency is low, and the deposition surface cannot be directly cooled are overcome. |
Author | MA WANTAI ZHANG HAO ZHANG JIE |
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RelatedCompanies | JIANGSU HAORAN SPRAY FORMING ALLOY CO., LTD |
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Snippet | The invention discloses a cooling system and method for spray forming of silicon-aluminum alloy. The system is composed of a first-level deposition surface... |
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Title | Cooling system and method for spray forming of silicon-aluminum alloy |
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