High temperature-resistant high-heat radiation epoxy resin-based encapsulating material and preparation method thereof

• Main Authors: WENG YUFEI, LI LI'NAN
• Format: Patent
• Language: English
• Published: 30.12.2015
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The invention discloses a high temperature-resistant high-heat radiation epoxy resin-based encapsulating material and a preparation method thereof. The encapsulating material comprises, by mass, 60 to 90 parts of alicyclic epoxy resin, 20 to 40 parts of trimethoxy hydrosilane, 9 to 20 parts of alkoxy silane, 4 to 12 parts of liquid paraffin, 3 to 10 parts of titanium dioxide, 2 to 7 parts of yttrium oxide, 3 to 8 parts of molybdenum powder, 16 to 28 parts of a curing agent, 2 to 9 parts of a compatilizer and 2 to 10 parts of a curing accelerator. The epoxy resin-based encapsulating material prepared in the invention has heat conductivity of 1.85 to 2.46 W/(m.K), thermal decomposition temperature of more than 420 DEG C after curing and good heat conduction and high temperature resistance; moreover, the tensile strength of the encapsulating material is maintained to be more than 34.6 Mpa, so the material shows good overall performance.