Backside illuminated color image sensors and methods for manufacturing the same

• Main Authors: DYSON HSINIH TAI, VINCENT VENEZIA, WEI ZHENG
• Format: Patent
• Language: English
• Published: 25.11.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method for manufacturing a backside illuminated color image sensor includes (a) modifying the frontside of an image sensor wafer, having pixel arrays, to produce electrical connections to the pixel arrays, wherein the electrical connections extend depth-wise into the image sensor wafer from the fr...