Method for producing a dielectric and/or barrier layer or multilayer on a substrate, and device for implementing said method

• Main Authors: YUBERO VALENCIA FRANCISCO, RODRIGUEZ GONZALEZ-ELIPE AGUSTIN, SANCHEZ CORTEZON EMILIO, ESPINOS MANZORRO JUAN PEDRO, DELGADO SANCHEZ JOSE MARIA, GIL ROSTRA JORGE, RICO GAVIRA VICTOR
• Format: Patent
• Language: English
• Published: 30.09.2015
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The invention relates to a method for producing dielectric and/or barrier layers on a substrate, characterized in that it comprises the following steps: (a) cleaning substrates, (b) placing the substrate in a sample carrier and introducing same into a vacuum chamber, (c) dosing an inert gas and a reactive gas into said vacuum chamber, (d) injecting, into said vacuum chamber, a volatile precursor that has at least one cation of the compound to be deposited, (e) activating a radiofrequency source and activating at least one magnetron, (f) decomposition of the volatile precursor by plasma, producing the reaction between the cation of the volatile precursor and the reactive gas at the same time as the reaction is produced between the reactive gas contained in the plasma with the cation generated from the target by cathode sputtering, thereby generating the deposition of the film on the substrate. The invention also relates to the device for carrying out said method.