Electrostatic chuck

• Main Authors: ANADA KAZUKI, MATSUI HIROKI, YAMAGUCHI KOSUKE, KOGA TATSUYA
• Format: Patent
• Language: English
• Published: 30.09.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides an electrostatic chuck, which prevents an adhesive from being less damaged by plasma. To be specific, the electrostatic chuck includes: a ceramic dielectric substrate having a first major surface for holding an absorbed object, a second major surface opposite to the first major surface, and a through-hole arranged from the second major surface to the first major surface; a metallic base plate which supports the ceramic dielectric substrate and has a gas introduction path that communicates with the through-hole; and a bonding layer which is provided between the ceramic dielectric substrate and the base plate and includes a resin material, the bonding layer having a space which is provided between an opening of the through-hole in the second major surface and the gas introduction path and is larger than the opening in a horizontal direction, and a first area in which an end face of the bonding layer on a side of the space intersects with the second major surface being recessed from the opening further than another second area of the end face which is different from the first area.