Lamination-free method for packaging lead frames
The invention discloses a lamination-free method for packaging lead frames, relates to improvement of a lamination-free method for packaging lead frames, and provides a lamination-free method for packaging lead frames which are simple and reasonable in structure and high in reliability. According to...
Saved in:
Main Author | |
---|---|
Format | Patent |
Language | English |
Published |
27.05.2015
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!