Lamination-free method for packaging lead frames

The invention discloses a lamination-free method for packaging lead frames, relates to improvement of a lamination-free method for packaging lead frames, and provides a lamination-free method for packaging lead frames which are simple and reasonable in structure and high in reliability. According to...

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Bibliographic Details
Main Author HUI TIEJUN
Format Patent
LanguageEnglish
Published 27.05.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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