Lamination-free method for packaging lead frames

• Main Author: HUI TIEJUN
• Format: Patent
• Language: English
• Published: 27.05.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a lamination-free method for packaging lead frames, relates to improvement of a lamination-free method for packaging lead frames, and provides a lamination-free method for packaging lead frames which are simple and reasonable in structure and high in reliability. According to the technical scheme adopted by the invention, the method comprises the following steps: controlling a process of pasting grains, wherein the main problem of pasting the grains is pollution of silver slurry, adhesives with low diffusion are firstly selected and then the adhesive discharging quantity is controlled not to excessively exceed a chip; controlling a process of bonding wires, namely opening a pressure plate, temporarily stopping heating by enabling the lead frames to leave a heating block, halting for one minute and automatically opening the heating block; controlling a progress of removing adhesives and wefts, wherein the process of removing the adhesives and the wefts serves as a process which has a maximum possibility of causing lamination because the process is a unique wet process in a packaging factory and can bring water vapor and electrochemical effects, the water vapor invades a packaging body while the electrochemical effects accelerate the erosion; an electrolytic adhesive removing process cannot be applied to products with exposed substrates; the processes can be used for relieving the erosion of the water vapor to the packaging body.