Liquid ejection head and liquid ejection apparatus

The invention relates to a liquid ejection head and a liquid ejection apparatus. A liquid ejection head includes an electrical wiring substrate and a printing element substrate, wherein the position variation of the printing element substrate due to curing of a sealing agent is eliminated. Specifica...

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Bibliographic Details
Main Authors SHUZO IWANAGA, ZENTARO TAMENAGA, KAZUHIRO YAMADA, TAKATSUGU MORIYA, TAKUTO MORIGUCHI
Format Patent
LanguageEnglish
Published 11.02.2015
Subjects
CORRECTION OF TYPOGRAPHICAL ERRORS
i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME
LINING MACHINES
PERFORMING OPERATIONS
PRINTING
SELECTIVE PRINTING MECHANISMS
STAMPS
TRANSPORTING
TYPEWRITERS
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Summary:The invention relates to a liquid ejection head and a liquid ejection apparatus. A liquid ejection head includes an electrical wiring substrate and a printing element substrate, wherein the position variation of the printing element substrate due to curing of a sealing agent is eliminated. Specifically, a gap between two support members is covered with the electrical wiring substrate so as to be able to prevent a first sealing agent from flowing into this gap. As a result, even in the case where the size of the gap varies due to the variation in the dimensional accuracy and/or the variation in the assembly accuracy, the first sealing agent will not enter this gap, and therefore the shape thereof can be made substantially uniform regardless of the positions. This results in a substantially uniform stress in curing and contracting of the first sealing agent, and the variation in the mounting position of the printing element substrate can be suppressed.
Bibliography:Application Number: CN20141356125