Flexible substrate with crimping interconnection

The invention discloses a flexible substrate with crimping interconnection. A semiconductor device includes first and second flexible substrates each with first and second peripheral edges. First and second dies are attached on respective surfaces of the flexible substrates and are each respectively...

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Bibliographic Details
Main Authors NAVAS KHAN ORATTI KALANDAR, TAY SHARON HUEY LIN, LOW BOON YEW
Format Patent
LanguageChinese
English
Published 03.12.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention discloses a flexible substrate with crimping interconnection. A semiconductor device includes first and second flexible substrates each with first and second peripheral edges. First and second dies are attached on respective surfaces of the flexible substrates and are each respectively electrically connected to first and second metal traces. A first crimping structure electrically connects the first metal traces to the second metal traces and crimps together the first peripheral edges of the first and second substrates. A second crimping structure electrically connects the first metal traces to the second metal traces and crimps together the second peripheral edges of the first and second substrates.
Bibliography:Application Number: CN201410070601