Method for forming metal film, conductive ink, multilayer wiring board, semiconductor substrate, and capacitor cell
The invention provides a method for forming a metal film, conductive ink, a multilayer wiring board, a semiconductor substrate, and a capacitor cell. The invention aims at, for a surface connected with a hole of a substrate including the hole, providing a method for easily forming a metal film on th...
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Main Authors | , , , , |
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Format | Patent |
Language | Chinese English |
Published |
03.09.2014
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Subjects | |
Online Access | Get full text |
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Summary: | The invention provides a method for forming a metal film, conductive ink, a multilayer wiring board, a semiconductor substrate, and a capacitor cell. The invention aims at, for a surface connected with a hole of a substrate including the hole, providing a method for easily forming a metal film on the surface by using a simple method. The method for forming the metal film comprises steps of heating the substrate under the condition that the surface connected with the hole of a substrate including the hole is in contact with the conductive ink including metal salt and reductant. |
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Bibliography: | Application Number: CN201410064784 |