Molded package for light emitting device

• Main Authors: KASAE NOBUHIDE, SEJIKI KEISUKE
• Format: Patent
• Language: Chinese; English
• Published: 03.07.2013
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF; HEATING; LIGHTING; MECHANICAL ENGINEERING; SEMICONDUCTOR DEVICES; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR; WEAPONS

The present invention provides a molded package capable of mounting light emitting components having different sizes accurately. The molded package 10 includes a molded resin 11 having a recess portion 12 for accommodating the light emitting component; and a first lead 20 and a second lead 30 which...