Molded package for light emitting device

• Main Authors: KASAE NOBUHIDE, SEJIKI KEISUKE
• Format: Patent
• Language: Chinese; English
• Published: 03.07.2013
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF; HEATING; LIGHTING; MECHANICAL ENGINEERING; SEMICONDUCTOR DEVICES; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR; WEAPONS

The present invention provides a molded package capable of mounting light emitting components having different sizes accurately. The molded package 10 includes a molded resin 11 having a recess portion 12 for accommodating the light emitting component; and a first lead 20 and a second lead 30 which are spaced each other at a bottom surface 121 of the recess portion 12 of the molded resin and exposed from the bottom surface of the recess portion, wherein the exposed surface 21 of the first lead has a first and second edge portions 23, 25 opposed to each other so as to put a mounting area 60 therebetween in a first direction, the first and second edge portions 23, 25 respectively having one first cutout 24 second cutouts 26, and wherein the mounting area 60 has a size 60L not less than a distance 601L between the first cutout 24 and the second cutouts 26 and less than a distance 602L between the first edge portion 23 and the second edge portion 25 in the first direction.