Polyamide resin

The polyamide resin of the present invention is a polymer comprising (A) aliphatic diamine and (B) dicarboxylic acid, wherein the (A) aliphatic diamine includes (a1) a first aliphatic diamine monomer selected from at least one of C4, C6, C8 and C10 aliphatic diamines, and (a2) an aliphatic diamine m...

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Bibliographic Details
Main Authors KIM YONG TAE, JANG SEUNG HYUN, LEE MYUNG RYUL, JANG BOK NAM, KWON SO YOUNG, JIN YOUNG SUB, IM SANG KYUN
Format Patent
LanguageChinese
English
Published 22.05.2013
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:The polyamide resin of the present invention is a polymer comprising (A) aliphatic diamine and (B) dicarboxylic acid, wherein the (A) aliphatic diamine includes (a1) a first aliphatic diamine monomer selected from at least one of C4, C6, C8 and C10 aliphatic diamines, and (a2) an aliphatic diamine monomer selected from at least one of C12, C14, C16 and C18 second aliphatic diamines. Said polymer has good melt processability, low absorbency, and excellent brightness.
Bibliography:Application Number: CN201080069173