Composition for heat-storage material, and heat-storage material

• Main Authors: KOUJINA JUNJI, KOMIYAMA SUSUMU, SHIMAKAGE MASASHI, SANO TAKUYA, HAYAKAWA TOSHIYUKI
• Format: Patent
• Language: English
• Published: 22.04.2015
• Subjects: ADHESIVES; BLASTING; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; HEAT EXCHANGE IN GENERAL; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEATING; LIGHTING; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; MECHANICAL ENGINEERING; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WEAPONS

[Object] The invention provides a thermal storage medium composition capable of forming a thermal storage medium which is free from phase separation or liquid phase bleeding and is excellent in shape retention properties even at or above the maximum crystal transition temperature of a paraffin compound and further exhibits excellent fluidity when being shaped. [Solution] A thermal storage medium composition includes 100 parts by mass of a hydrogenated diene copolymer and 50 to 4000 parts by mass of a paraffin compound, the hydrogenated diene copolymer being a conjugated diene copolymer that is obtained by hydrogenating a block copolymer which includes a block (A) that contains structural units (a-1) derived from a conjugated diene compound and has a vinyl bond content of not more than 20 mol%, and a block (B) that contains structural units (b-1) derived from a conjugated diene compound and has a vinyl bond content of 30 to 95 mol%, the hydrogenation ratio with respect to the double bonds derived from the conjugated diene compounds being not less than 90%.