Side edge packaged type PCB (printed circuit board)

• Main Author: LIN XIANJIE
• Format: Patent
• Language: Chinese; English
• Published: 28.09.2011
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The invention provides a side edge packaged PCB (printed circuit board). The side edge packaged PCB comprises a circuit board, an inner layer line and a first side edge electrical connecting pad, wherein the circuit board is provided with a surface and a side face which are adjacent to each other; the inner layer line covers part surface of the circuit board; the first side edge electrical connecting pad is electrically connected with the inner layer line, wherein the first side edge electrical connecting pad and the inner layer line are arranged in the same adding layer. Compared with the well-known PCB, four sides of the side edge packaged type PCB provided by the invention can serve as the packaging faces, so the packaging faces of the PCB can reach up to six (including a chip side, a loading sphere side and four side faces of the PCB), electronic components with different functions can be arranged on the four sides of the PCB as needed so as to meet the requirement of a high-density packaging.