Semiconductor package with single sided substrate design and manufacturing methods thereof

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Main Authors SU YUANANG, CHEN CHIANG, HUANG SHIH-FU, LEE MING CHIANG, CHEN TZU-HUI, CHEN KUANG-HSIUNG, HSIEH PAO-MING, APPELT BERND KARL
Format Patent
LanguageEnglish
Published 25.03.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Author LEE MING CHIANG
CHEN TZU-HUI
APPELT BERND KARL
HUANG SHIH-FU
CHEN KUANG-HSIUNG
CHEN CHIANG
SU YUANANG
HSIEH PAO-MING
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– fullname: CHEN KUANG-HSIUNG
– fullname: HSIEH PAO-MING
– fullname: APPELT BERND KARL
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Semiconductor package with single sided substrate design and manufacturing methods thereof
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