Thermally conductive gel packs
A conformable, thermally-conductive gel pack is provided having a thermal gel encapsulated by a compliant packaging material formed from a dielectric polymer. The gel pack is adapted for emplacement between opposed heat transfer surfaces in an electronic device. One heat transfer surface can be part...
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Main Authors | , , , , |
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Format | Patent |
Language | Chinese English |
Published |
10.08.2011
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Subjects | |
Online Access | Get full text |
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