Thermally conductive gel packs
A conformable, thermally-conductive gel pack is provided having a thermal gel encapsulated by a compliant packaging material formed from a dielectric polymer. The gel pack is adapted for emplacement between opposed heat transfer surfaces in an electronic device. One heat transfer surface can be part...
Saved in:
Main Authors | , , , , |
---|---|
Format | Patent |
Language | Chinese English |
Published |
10.08.2011
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | A conformable, thermally-conductive gel pack is provided having a thermal gel encapsulated by a compliant packaging material formed from a dielectric polymer. The gel pack is adapted for emplacement between opposed heat transfer surfaces in an electronic device. One heat transfer surface can be part of a heat-generating component of the device, while the other heat transfer surface can be part of a heat sink or a circuit board. |
---|---|
AbstractList | A conformable, thermally-conductive gel pack is provided having a thermal gel encapsulated by a compliant packaging material formed from a dielectric polymer. The gel pack is adapted for emplacement between opposed heat transfer surfaces in an electronic device. One heat transfer surface can be part of a heat-generating component of the device, while the other heat transfer surface can be part of a heat sink or a circuit board. |
Author | BUNYAN MICHAEL H BLAZDELL PHILIP RUTTI HARISH WOOD GARY O'RIORDAN EOIN |
Author_xml | – fullname: BUNYAN MICHAEL H – fullname: BLAZDELL PHILIP – fullname: O'RIORDAN EOIN – fullname: RUTTI HARISH – fullname: WOOD GARY |
BookMark | eNrjYmDJy89L5WSQC8lILcpNzMmpVEjOz0spTS7JLEtVSE_NUShITM4u5mFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcVANal5qSXxzn6GBkaGpgYmFiaOxsSoAQDabCZF |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
ExternalDocumentID | CN102150484A |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_CN102150484A3 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 16:44:59 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | Chinese English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_CN102150484A3 |
Notes | Application Number: CN20098135570 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110810&DB=EPODOC&CC=CN&NR=102150484A |
ParticipantIDs | epo_espacenet_CN102150484A |
PublicationCentury | 2000 |
PublicationDate | 20110810 |
PublicationDateYYYYMMDD | 2011-08-10 |
PublicationDate_xml | – month: 08 year: 2011 text: 20110810 day: 10 |
PublicationDecade | 2010 |
PublicationYear | 2011 |
RelatedCompanies | PARKER HANNIFIN CORP |
RelatedCompanies_xml | – name: PARKER HANNIFIN CORP |
Score | 2.925556 |
Snippet | A conformable, thermally-conductive gel pack is provided having a thermal gel encapsulated by a compliant packaging material formed from a dielectric polymer.... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
Title | Thermally conductive gel packs |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110810&DB=EPODOC&locale=&CC=CN&NR=102150484A |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQATahU5LTzI10U4A9IGAHxTRVN9Ek1VjXPDE5zSjNPNE8BXx2p6-fmUeoiVeEaQQTQxZsLwz4nNBy8OGIwByVDMzvJeDyugAxiOUCXltZrJ-UCRTKt3cLsXVRS4EN9wFrOAM1Fydb1wB_F39nNWdnW2c_Nb8gW9AN1qbA1GriyMzACmpGg87Zdw1zAu1KKUCuUtwEGdgCgKbllQgxMFVlCDNwOsNuXhNm4PCFTngDmdC8VyzCIAeMUWApmpNTqQDsw4KOaQUWVArpqTkKBaB98qIMim6uIc4eukCL4uG-inf2Q7jJWIyBBdjbT5VgULAwTE1NNARd_2WSZpJqlJRonGxkkWRqmASsY4DZ0VSSQQq3OVL4JKUZuGADooYGMgwsJUWlqbLAGrUkSQ4cFACJbnj2 |
link.rule.ids | 230,309,786,891,25594,76903 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQATahU5LTzI10U4A9IGAHxTRVN9Ek1VjXPDE5zSjNPNE8BXx2p6-fmUeoiVeEaQQTQxZsLwz4nNBy8OGIwByVDMzvJeDyugAxiOUCXltZrJ-UCRTKt3cLsXVRS4EN9wFrOAM1Fydb1wB_F39nNWdnW2c_Nb8gW9AN1qbA1GriyMzAag7sEoK7SmFOoF0pBchVipsgA1sA0LS8EiEGpqoMYQZOZ9jNa8IMHL7QCW8gE5r3ikUY5IAxCixFc3IqFYB9WNAxrcCCSiE9NUehALRPXpRB0c01xNlDF2hRPNxX8c5-CDcZizGwAHv7qRIMChaGqamJhqDrv0zSTFKNkhKNk40skkwNk4B1DDA7mkoySOE2RwqfpDwDp0eIr0-8j6eftzQDF2xw1NBAhoGlpKg0VRZYu5YkyYGDBQBWUHvg |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Thermally+conductive+gel+packs&rft.inventor=BUNYAN+MICHAEL+H&rft.inventor=BLAZDELL+PHILIP&rft.inventor=O%27RIORDAN+EOIN&rft.inventor=RUTTI+HARISH&rft.inventor=WOOD+GARY&rft.date=2011-08-10&rft.externalDBID=A&rft.externalDocID=CN102150484A |