Radiant heat structure for pin type power led

• Main Authors: LEE CHANG-WON, CHO YEON-SU, CHO KYUNG-MIN
• Format: Patent
• Language: Chinese; English
• Published: 19.01.2011
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

This invention relates to a radiant heat structure for a pin type power LED which is used in an automobile, a lamp, an advertisement board, etc. The configuration of the radiant heat structure includes: an LED device; a first lead frame that is electrically connected to the LED device, and has plural leads extended toward a substrate to supply electric power to the LED device; a second lead frame which faces the first lead frame and has plural leads extended toward the substrate; a molding part, where the upper portions of the first and second lead frames are molded with a transparent material, and wherein the LED device is included; and a heatsink which receives the heat from the LED device and radiates the heat to the outside by being connected to the leads of the first lead frame. Each lead of the first and second lead frames passes through the space between the molding part and the substrate. The radiant heat structure radiates generated heat to the outside efficiently through a lead frame connected to an