Method for manufacturing a semiconductor device, method and structure for mounting the semiconductor device

• Main Author: TANAKA HIDEICHI
• Format: Patent
• Language: Chinese; English
• Published: 21.10.2009
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention provides a method for manufacturing a semiconductor device for improving a productivity of the semiconductor device, a method and a structure for mounting the semiconductor device. A protective layer (4) is coated with an acroid resin which is used as a light-sensitive resin for forming a bulging body (5), to form a resin layer. On the resin layer, a mask having an opening portion is located at a prescribed position, further part of the resin layer exposing from the opening portion is exposed by irradiating ultraviolet on the mask. By means of solidifying the resin through the ultraviolet, a cylinder-shaped bulging body (5b) having a plane top is formed. Then, the ultraviolet (11) is irradiated on the bulging body (5b) to heat the bulging body (5b), such that the acroid resin for forming the bulging body (5b) is melted. Due to a surface tension generated on the melted resin, the top of the planar bulging body (5b) is deformed into a smooth curved face. thereby a near-hemisphere-shaped bu