Method for manufacturing semiconductor device

• Main Authors: SUGA HIDEYUKI, MAKI HIROMI
• Format: Patent
• Language: Chinese; English
• Published: 10.12.2008
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Extremely thin chips laminated to a non-ultraviolet ray curing type adhesive tape are peeled from the tape without giving rise to cracks and chippings. In a center portion of a suction block used for peeling off a chip laminated to a dicing tape, three blocks which push the dicing tape upwardly are...