Lead free alloys for column/ball grid arrays, organic interposers and passive component assembly

A lead free solder hierarchy structure for electronic packaging that includes organic interposers. The assembly may also contain passive components as well as underfill material. The lead free solder hierarchy also provides a lead free solder solution for the attachment of a heat sink to the circuit...

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Bibliographic Details
Main Author FAROOQ MUKTA G.,INTERRANTE MARIO J
Format Patent
LanguageEnglish
Published 17.10.2007
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Abstract A lead free solder hierarchy structure for electronic packaging that includes organic interposers. The assembly may also contain passive components as well as underfill material. The lead free solder hierarchy also provides a lead free solder solution for the attachment of a heat sink to the circuit chip with a suitable lead free solder alloy.
AbstractList A lead free solder hierarchy structure for electronic packaging that includes organic interposers. The assembly may also contain passive components as well as underfill material. The lead free solder hierarchy also provides a lead free solder solution for the attachment of a heat sink to the circuit chip with a suitable lead free solder alloy.
Author FAROOQ MUKTA G.,INTERRANTE MARIO J
Author_xml – fullname: FAROOQ MUKTA G.,INTERRANTE MARIO J
BookMark eNqNjLsKwkAQRbfQwtc_jL1iYgjWEhQLsbKPk-wkLGxml5ko5O_dwg-wOnA49y7NjAPTwrzuhBY6IQL0PkwKXRBog38PfGiSgl6cBRTBSXcQpEd2LTgeSWJQEgVkCxFV3YfScIjpl0dIgobGT2sz79ArbX5cme318qxue4qhJo3YEtNYV488y7PyVBzLc_FP8wUBHj8m
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID CN101057325A
GroupedDBID EVB
ID FETCH-epo_espacenet_CN101057325A3
IEDL.DBID EVB
IngestDate Fri Jul 19 16:00:10 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_CN101057325A3
Notes Application Number: CN200380110302
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20071017&DB=EPODOC&CC=CN&NR=101057325A
ParticipantIDs epo_espacenet_CN101057325A
PublicationCentury 2000
PublicationDate 20071017
PublicationDateYYYYMMDD 2007-10-17
PublicationDate_xml – month: 10
  year: 2007
  text: 20071017
  day: 17
PublicationDecade 2000
PublicationYear 2007
RelatedCompanies IBM
RelatedCompanies_xml – name: IBM
Score 2.6830564
Snippet A lead free solder hierarchy structure for electronic packaging that includes organic interposers. The assembly may also contain passive components as well as...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
Title Lead free alloys for column/ball grid arrays, organic interposers and passive component assembly
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20071017&DB=EPODOC&locale=&CC=CN&NR=101057325A
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3fT8IwEL4gGvVNUaP4I2di9uQCG4PBAzHSQYgJgxg0vGG7dmZGB9lmDP-91wHii74116zp2t312_XuPoAbXZ_FDR1lNuygaRKkViYnqG8SNK8qRwrlWjrBeeA3-k_Ow6Q-KcDbOhcmrxP6lRdHJI0KSN-z3F7PN04sL4-tTCsiItHsrjdue8b679jVX5jhddrd0dAbMoOxNvMN_5Gwria0rdn1-y3YJhjtam3oPnd0Vsr895HSO4CdEY0WZ4dQUHEJ9tiaea0Eu4PVhTc1V7qXHsGLZsPEMFEK9WX5IkXCmxho6xJXBInwNYkk8iThi_QWl3RNAUZLIi2dVIk8ljgntEwWDnUs-SymCSAJ1Id4XxzDda87Zn2Tpjr9WZcp8zdvVTuBYkxPnQI6VmjxliNbNpdOXTZol2QgQsktZYfVpjiD8t_jlP_rPIf93LWpAzrcCyhmyae6pDM5E1f5Yn4DWiOS1g
link.rule.ids 230,309,783,888,25576,76882
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3fT8IwEL4gGvFNUaP4qyZmTy6wMRg8ECMdZCoMYtDwhu3aGYwOss0Y_nuvg4kv-tZcs6Zrd9dv17v7AK5UfRY7sKReN_2GjpBa6gyhvo7QvCItwaVtqATnvld3n6z7cW2cg7csFyatE_qVFkdEjfJR35PUXs_XTiwnja2My3yKotlNd9RytOzv2FZfmOa0W53hwBlQjdIW9TTvEbGuIrStmrXbDdhEiN1QbAed57bKSpn_PlK6u7A1xNHCZA9yMixCgWbMa0XY7q8uvLG50r14H14UGyYJIimJuixfxATxJvGVdQnLHEXkNZoKwqKILeJrsqRr8sl0SaSlkioJCwWZI1pGC0dULPksxAkQFMgP_r44gMtuZ0RdHac6-VmXCfXWb1U9hHyITx0BsYzAYE1LNE0mrJqo4y4JnweCGdIMKg1-DKW_xyn913kBBXfU7016d97DCeykbk4V3GGfQj6JPuUZns8JP08X9htloJXG
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Lead+free+alloys+for+column%2Fball+grid+arrays%2C+organic+interposers+and+passive+component+assembly&rft.inventor=FAROOQ+MUKTA+G.%2CINTERRANTE+MARIO+J&rft.date=2007-10-17&rft.externalDBID=A&rft.externalDocID=CN101057325A