Method of packaging semiconductor die
A method of packaging a semiconductor die ( 10 ) includes providing a flip-chip die ( 10 ) with bump connections ( 12 ) on its bottom surface ( 14 ). An adhesive tape ( 18 ) is attached to a plate surface ( 16 ) and lead fingers ( 20 ) are formed on the tape ( 18 ). The die ( 10 ) is placed on the t...
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| Main Author | |
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| Format | Patent |
| Language | English |
| Published |
26.09.2007
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A method of packaging a semiconductor die ( 10 ) includes providing a flip-chip die ( 10 ) with bump connections ( 12 ) on its bottom surface ( 14 ). An adhesive tape ( 18 ) is attached to a plate surface ( 16 ) and lead fingers ( 20 ) are formed on the tape ( 18 ). The die ( 10 ) is placed on the tape ( 18 ) such that the bumps ( 12 ) on the die ( 10 ) contact respective ones of the lead fingers ( 20 ) on the tape ( 18 ). A reflow process is performed on the die ( 10 ), the tape ( 18 ) and the plate ( 16 ), which forms C5 type interconnects. A mold compound ( 24 ) is formed over the die ( 10 ) and the tape ( 18 ), and then the tape ( 18 ) and the plate ( 16 ) are removed. |
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| AbstractList | A method of packaging a semiconductor die ( 10 ) includes providing a flip-chip die ( 10 ) with bump connections ( 12 ) on its bottom surface ( 14 ). An adhesive tape ( 18 ) is attached to a plate surface ( 16 ) and lead fingers ( 20 ) are formed on the tape ( 18 ). The die ( 10 ) is placed on the tape ( 18 ) such that the bumps ( 12 ) on the die ( 10 ) contact respective ones of the lead fingers ( 20 ) on the tape ( 18 ). A reflow process is performed on the die ( 10 ), the tape ( 18 ) and the plate ( 16 ), which forms C5 type interconnects. A mold compound ( 24 ) is formed over the die ( 10 ) and the tape ( 18 ), and then the tape ( 18 ) and the plate ( 16 ) are removed. |
| Author | ISMAIL AMINUDDIN,FOONG CHEE S.,IBRAHIM RUZAINI |
| Author_xml | – fullname: ISMAIL AMINUDDIN,FOONG CHEE S.,IBRAHIM RUZAINI |
| BookMark | eNrjYmDJy89L5WRQ9U0tychPUchPUyhITM5OTM_MS1coTs3NTM7PSylNLskvUkjJTOVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFQJ2peakl8c5-hgaGBibGBgaWjsbEqAEAFmsoug |
| ContentType | Patent |
| DBID | EVB |
| DatabaseName | esp@cenet |
| DatabaseTitleList | |
| Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Medicine Chemistry Sciences |
| ExternalDocumentID | CN101043009A |
| GroupedDBID | EVB |
| ID | FETCH-epo_espacenet_CN101043009A3 |
| IEDL.DBID | EVB |
| IngestDate | Fri Jul 19 16:00:10 EDT 2024 |
| IsOpenAccess | true |
| IsPeerReviewed | false |
| IsScholarly | false |
| Language | English |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-epo_espacenet_CN101043009A3 |
| Notes | Application Number: CN200710004727 |
| OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070926&DB=EPODOC&CC=CN&NR=101043009A |
| ParticipantIDs | epo_espacenet_CN101043009A |
| PublicationCentury | 2000 |
| PublicationDate | 20070926 |
| PublicationDateYYYYMMDD | 2007-09-26 |
| PublicationDate_xml | – month: 09 year: 2007 text: 20070926 day: 26 |
| PublicationDecade | 2000 |
| PublicationYear | 2007 |
| RelatedCompanies | FREESCALE SEMICONDUCTOR INC |
| RelatedCompanies_xml | – name: FREESCALE SEMICONDUCTOR INC |
| Score | 2.689163 |
| Snippet | A method of packaging a semiconductor die ( 10 ) includes providing a flip-chip die ( 10 ) with bump connections ( 12 ) on its bottom surface ( 14 ). An... |
| SourceID | epo |
| SourceType | Open Access Repository |
| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | Method of packaging semiconductor die |
| URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070926&DB=EPODOC&locale=&CC=CN&NR=101043009A |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_mFPVNp6Lzgwrat2A_YmYeiri0ZQjthkzZ22hmClNox1rx3_cSV-eLvoUELh9wud8ld78DuGJ3XBOLuSTPHUkoAmrCleqRWZ4pRqXMuCHTSVI2eKaPk9tJC96aXBjDE_ppyBFRo2ao77W5rxfrR6zQxFZWN3KOXeV9PA5Cu_GOew73mB32g2g0DIfCFiIQqZ0-IdZ1NbuVwx82YFPDaM2zH730dVbK4rdJifdga4TSinofWqrowI5oKq91YDtZfXhjc6V71QFcJ6bYs1XmFi753VQXsiod214WmrS1XFqvc3UIl3E0FgOC801_NjcV6Xpp_hG00elXx2Bx5TGPKp8joKOZ60vEYX7OpZdLSvnMPYHu33K6_w2ewu73-yQnHjuDdr38UOdoWGt5YU7kC-pLeyg |
| link.rule.ids | 230,309,786,891,25594,76904 |
| linkProvider | European Patent Office |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_mFOebTkXnVwXtW7EfsTUPRVy6UXXthlTZW2lqClNox1rx3_caV-eLvoUELpfA5T5y9zuAC_uG1sBihpZlOtcIGtQaFcLR0iwRNuE8oRJMJwht_5k8TK-nLXhramEkTuinBEdEiUpR3iv5Xs9XQSxP5laWV3yGU8XtMHI9tfGOHZ2atur13cFk7I2ZypjLQjV8QlvXqNGtdHq3BusOuoQ1zv7gpV9Xpcx_q5ThNmxMkFpe7UBL5F3osKbzWhc2g-WHNw6XslfuwmUgmz0rRaYgy--yu5BS1rntRV6DthYL5XUm9uB8OIiYr-F-8c_hYhauWLP2oY1OvzgAhQrTNomwKBp0JDEsjnaYlVFuZpwQmhqH0PubTu-_xTPo-FEwikf34eMRbH3HKqlm2sfQrhYf4gSVbMVP5e18AdIOfhM |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Method+of+packaging+semiconductor+die&rft.inventor=ISMAIL+AMINUDDIN%2CFOONG+CHEE+S.%2CIBRAHIM+RUZAINI&rft.date=2007-09-26&rft.externalDBID=A&rft.externalDocID=CN101043009A |