Noncontact IC label and method and apparatus for manufacturing the same

• Main Author: KAGAYA HITOSHI,IDE YOSHIAKI,YAMAKAMI TAKESHI,OHNOHIROKI
• Format: Patent
• Language: English
• Published: 01.08.2007
• Subjects: BASIC ELECTRIC ELEMENTS; BOOK COVERS; BOOKBINDING; CALCULATING; COMPUTING; COUNTING; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILES; HANDLING RECORD CARRIERS; INDUCTANCES; LOOSE LEAVES; MAGNETS; MOVABLE-STRIP WRITING OR READING APPARATUS; PERFORMING OPERATIONS; PHYSICS; PRESENTATION OF DATA; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR; RECOGNITION OF DATA; RECORD CARRIERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES; SEMICONDUCTOR DEVICES; SPECIAL PRINTED MATTER; TRANSFORMERS; TRANSMISSION; TRANSPORTING

A noncontact IC label includes an electrically insulating first board; an antenna coil provided on one plane of the first board; an IC chip electrically connected to the antenna coil; a magnetic layer provided to cover the antenna coil and the IC chip on the one plane of the first board; a first adhesive layer provided through the magnetic layer; an electrically insulating second board provided through the first adhesive layer; a second adhesive layer provided through the second board; peeling paper provided through the second adhesive layer; and an upper member provided on the other plane of the first board through a third adhesive layer.