Noncontact IC label and method and apparatus for manufacturing the same

A noncontact IC label includes an electrically insulating first board; an antenna coil provided on one plane of the first board; an IC chip electrically connected to the antenna coil; a magnetic layer provided to cover the antenna coil and the IC chip on the one plane of the first board; a first adh...

Full description

Saved in:
Bibliographic Details
Main Author KAGAYA HITOSHI,IDE YOSHIAKI,YAMAKAMI TAKESHI,OHNOHIROKI
Format Patent
LanguageEnglish
Published 01.08.2007
Subjects
BASIC ELECTRIC ELEMENTS
BOOK COVERS
BOOKBINDING
CALCULATING
COMPUTING
COUNTING
DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FILES
HANDLING RECORD CARRIERS
INDUCTANCES
LOOSE LEAVES
MAGNETS
MOVABLE-STRIP WRITING OR READING APPARATUS
PERFORMING OPERATIONS
PHYSICS
PRESENTATION OF DATA
PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES
PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR
RECOGNITION OF DATA
RECORD CARRIERS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
SEMICONDUCTOR DEVICES
SPECIAL PRINTED MATTER
TRANSFORMERS
TRANSMISSION
TRANSPORTING
Online AccessGet full text

Cover

More Information
Summary:A noncontact IC label includes an electrically insulating first board; an antenna coil provided on one plane of the first board; an IC chip electrically connected to the antenna coil; a magnetic layer provided to cover the antenna coil and the IC chip on the one plane of the first board; a first adhesive layer provided through the magnetic layer; an electrically insulating second board provided through the first adhesive layer; a second adhesive layer provided through the second board; peeling paper provided through the second adhesive layer; and an upper member provided on the other plane of the first board through a third adhesive layer.
Bibliography:Application Number: CN2005829424