Epoxy resin curing compositions and resin compositions including same
Epoxy resin composition curing agents, which include a primary amino alcohol, are disclosed. Specifically, the invention relates to curing agents which include a primary amino alcohol physically blended therewith. Alternatively, the invention relates to curing agents which include a primary amino al...
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Format | Patent |
Language | English |
Published |
12.09.2007
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Subjects | |
Online Access | Get full text |
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Abstract | Epoxy resin composition curing agents, which include a primary amino alcohol, are disclosed. Specifically, the invention relates to curing agents which include a primary amino alcohol physically blended therewith. Alternatively, the invention relates to curing agents which include a primary amino alcohol reacted into a resinous phenolic compound. Resin systems utilizing the curing agents of the invention exhibit enhanced hot wet adhesion to metal substrates and are particularly useful in the manufacture of powder coatings for pipe. |
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AbstractList | Epoxy resin composition curing agents, which include a primary amino alcohol, are disclosed. Specifically, the invention relates to curing agents which include a primary amino alcohol physically blended therewith. Alternatively, the invention relates to curing agents which include a primary amino alcohol reacted into a resinous phenolic compound. Resin systems utilizing the curing agents of the invention exhibit enhanced hot wet adhesion to metal substrates and are particularly useful in the manufacture of powder coatings for pipe. |
Author | WATKINS MICHAEL J.,PAWLIK ROBERT J |
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Notes | Application Number: CN200480002974 |
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Snippet | Epoxy resin composition curing agents, which include a primary amino alcohol, are disclosed. Specifically, the invention relates to curing agents which include... |
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SubjectTerms | CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP |
Title | Epoxy resin curing compositions and resin compositions including same |
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