MODULAR HYBRID CIRCUIT PACKAGING
An electronics package (100) includes a platform (102) and a board (104) mounted to the platform (102) the board (104) having electronics mounted thereon. A feedthrough pin (136- 148) passes through and is hermetically sealed to a feedthrough body (106) and is wire bonded to the board (104). A cover...
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Main Authors | , , , |
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Format | Patent |
Language | English French |
Published |
03.01.2019
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Subjects | |
Online Access | Get full text |
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