MODULAR HYBRID CIRCUIT PACKAGING

• Main Authors: STREI, DAVID MATTHEW, ANDREW, DAVID ALEXANDER, WALTERS, JAMES, CUTTER, DAVID
• Format: Patent
• Language: English; French
• Published: 03.01.2019
• Subjects: ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MEASURING; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE; MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR; PHYSICS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TARIFF METERING APPARATUS; TESTING

An electronics package (100) includes a platform (102) and a board (104) mounted to the platform (102) the board (104) having electronics mounted thereon. A feedthrough pin (136- 148) passes through and is hermetically sealed to a feedthrough body (106) and is wire bonded to the board (104). A cover (110) is bonded to and surrounds the exterior surface of the feedthrough body (106) to produce a hermetically sealed chamber (111) that houses the platform (102) and the board (104). Un boîtier électronique (100) comprend une plateforme (102) et une carte (104) montée sur la plateforme (102), la carte (104) ayant des composants électroniques montés sur celle-ci. Une broche (136-148) de traversée électrique traverse un corps (106) de traversée électrique, et est hermétiquement scellée à celui-ci, et est liée par un fil à la carte (104). Un couvercle (110) est lié à la surface extérieure du corps (106) de traversée électrique, et entoure celle-ci, pour produire une chambre hermétiquement scellée (111) qui loge la plateforme (102) et la carte (104).