MULTILAYER CIRCUIT DEVICES AND MANUFACTURING METHODS USING ELECTROPLATED SACRIFICIAL STRUCTURES
A multilayer circuit includes a dielectric base substrate, conductors formed on the base substrate and a vacuum deposited dielectric thin film formed over the conductors and the base substrate. The vacuum deposited dielectric thin film is patterned using sacrificial structures formed by electroplati...
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Main Authors | , |
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Format | Patent |
Language | English French |
Published |
26.11.2013
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Subjects | |
Online Access | Get full text |
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