MOUNTING STRUCTURE FOR A SEMICONDUCTOR CIRCUIT
In a tape carrier package applying a TAB technique, a flex rigid PWB is used as a tape carrier. A flexible portion is provided with a semiconductor connection terminal. An LSI is directly mounted to the flexible portion. A rigid portion is provided with an electrode for mounting a component and an e...
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| Main Author | |
|---|---|
| Format | Patent |
| Language | English French |
| Published |
18.09.2001
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| Edition | 6 |
| Subjects | |
| Online Access | Get full text |
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| Abstract | In a tape carrier package applying a TAB technique, a flex rigid PWB is used as a tape carrier. A flexible portion is provided with a semiconductor connection terminal. An LSI is directly mounted to the flexible portion. A rigid portion is provided with an electrode for mounting a component and an electrode for an external input/output. |
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| AbstractList | In a tape carrier package applying a TAB technique, a flex rigid PWB is used as a tape carrier. A flexible portion is provided with a semiconductor connection terminal. An LSI is directly mounted to the flexible portion. A rigid portion is provided with an electrode for mounting a component and an electrode for an external input/output. |
| Author | MIYOSHI, TADAYOSHI |
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| Discipline | Medicine Chemistry Sciences |
| DocumentTitleAlternate | STRUCTURE DE MONTAGE POUR CIRCUIT A SEMICONDUCTEUR |
| Edition | 6 |
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| Notes | Application Number: CA19972202426 |
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| PublicationCentury | 2000 |
| PublicationDate | 20010918 |
| PublicationDateYYYYMMDD | 2001-09-18 |
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| PublicationDecade | 2000 |
| PublicationYear | 2001 |
| RelatedCompanies | NEC CORPORATION |
| RelatedCompanies_xml | – name: NEC CORPORATION |
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| Snippet | In a tape carrier package applying a TAB technique, a flex rigid PWB is used as a tape carrier. A flexible portion is provided with a semiconductor connection... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| Title | MOUNTING STRUCTURE FOR A SEMICONDUCTOR CIRCUIT |
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