arquitetura de empacotamento flexível

• Main Authors: JACKSON CHUNG KONG, SHANGGAR PERIAMAN, KHENG TAT MAR, YEN HSIANG CHEW, RIDZA EFFENDI ABD RAZAK, BOK ENG CHEAH, MICHAEL SKINNER
• Format: Patent
• Language: Portuguese
• Published: 18.07.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A flexible packaging architecture is described that is suitable for curved package shapes. In one example a package has a first die, a first mold compound layer over the first die, a wiring layer over the first mold compound layer, a second die over the wiring layer and electrically coupled to the w...