ADDITIVE TO SOLUTIONS FOR DIELECTRICS ACTIVATION AT THEIR METALLING

• Main Authors: DOBREVA, EKATERINA D, ENCHEVA, MILKA A, LIRKOV, ALEKSANDAR L, TRENDAFILOV, ARKADIJ T, PETROV, KHRISTO B
• Format: Patent
• Language: English
• Published: 18.01.1994
• Edition: 5
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The dielectrics activation solutions are used in the metalling of different articles, especially for the needs of electronics. The additive improves the stability of the solutions of over 12 months and reduces surface tension as a result of which the wetting of the dielectric is improved and the sorption of the activating metal is increased. This in turn guarantees even and complete chemical metalling and prevents the contact deposition of palladium on the copper foil of the printed-circuit boards. The additive to the activation solutions contains nonylphenolpolyglycolether with 10 ethoxygroups, polyoxyethylenesor monooleate and polyethyleneglycol (M.m. = 3000/6000 = 1/10) in concentrations from 8.10-2 to 5 g/l.