Method of forming conductive interconnections wherein a barrier layer is removedby an etching process

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Main Authors JOHN A. IACOPONI, ERROL TODD RYAN, PETER J. BECKAGE, WILLIAM S. BRENNAN, FREDERICK N. HAUSE, FRANK MAUERSBERGER, PAUL R. BESSER
Format Patent
LanguageEnglish
Published 27.05.2002
Edition7
Subjects
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Author FREDERICK N. HAUSE
FRANK MAUERSBERGER
PAUL R. BESSER
WILLIAM S. BRENNAN
PETER J. BECKAGE
ERROL TODD RYAN
JOHN A. IACOPONI
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– fullname: PETER J. BECKAGE
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– fullname: FRANK MAUERSBERGER
– fullname: PAUL R. BESSER
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Method of forming conductive interconnections wherein a barrier layer is removedby an etching process
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