Top load socket for ball grid array devices
A test socket for temporary connection of a ball grid array integrated circuit device to a test circuit includes an array of contacts each including two cantilever arms biased toward each other and terminating in tips adapted to capture one ball of the device.
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| Main Author | |
|---|---|
| Format | Patent |
| Language | English |
| Published |
27.08.1996
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| Edition | 6 |
| Subjects | |
| Online Access | Get full text |
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| Abstract | A test socket for temporary connection of a ball grid array integrated circuit device to a test circuit includes an array of contacts each including two cantilever arms biased toward each other and terminating in tips adapted to capture one ball of the device. |
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| AbstractList | A test socket for temporary connection of a ball grid array integrated circuit device to a test circuit includes an array of contacts each including two cantilever arms biased toward each other and terminating in tips adapted to capture one ball of the device. |
| Author | KURT HERLOFF PETERSEN |
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| Edition | 6 |
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| Notes | Application Number: AU4689996 |
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| PublicationCentury | 1900 |
| PublicationDate | 19960827 |
| PublicationDateYYYYMMDD | 1996-08-27 |
| PublicationDate_xml | – month: 08 year: 1996 text: 19960827 day: 27 |
| PublicationDecade | 1990 |
| PublicationYear | 1996 |
| RelatedCompanies | MINNESOTA MINING AND MANUFACTURING COMPANY |
| RelatedCompanies_xml | – name: MINNESOTA MINING AND MANUFACTURING COMPANY |
| Score | 2.465 |
| Snippet | A test socket for temporary connection of a ball grid array integrated circuit device to a test circuit includes an array of contacts each including two... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING |
| Title | Top load socket for ball grid array devices |
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