HOT MELT APPLICATORS

In a hot melt adhesive dispensing gun, an electronic circuit is constructed to enable the operator to set a desired temperature to which the glue is heated. This set point is automatically raised a predetermined amount when the glue is flowing in order to compensate for the drop in temperature cause...

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Bibliographic Details
Main Authors RICHARD MONTGOMERY ELLIOTT, ROBERT JOHN DUNCAN
Format Patent
LanguageEnglish
Published 03.05.1979
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
CHEMISTRY
CONTROLLING
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
PERFORMING OPERATIONS
PHYSICS
POLISHES
REGULATING
SPRAYING OR ATOMISING IN GENERAL
SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
TRANSPORTING
USE OF MATERIALS AS ADHESIVES
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Abstract In a hot melt adhesive dispensing gun, an electronic circuit is constructed to enable the operator to set a desired temperature to which the glue is heated. This set point is automatically raised a predetermined amount when the glue is flowing in order to compensate for the drop in temperature caused by the loss of heat to the glue and atmosphere.
AbstractList In a hot melt adhesive dispensing gun, an electronic circuit is constructed to enable the operator to set a desired temperature to which the glue is heated. This set point is automatically raised a predetermined amount when the glue is flowing in order to compensate for the drop in temperature caused by the loss of heat to the glue and atmosphere.
Author RICHARD MONTGOMERY ELLIOTT
ROBERT JOHN DUNCAN
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Snippet In a hot melt adhesive dispensing gun, an electronic circuit is constructed to enable the operator to set a desired temperature to which the glue is heated....
SourceID epo
SourceType Open Access Repository
SubjectTerms ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
CHEMISTRY
CONTROLLING
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
PERFORMING OPERATIONS
PHYSICS
POLISHES
REGULATING
SPRAYING OR ATOMISING IN GENERAL
SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
TRANSPORTING
USE OF MATERIALS AS ADHESIVES
Title HOT MELT APPLICATORS
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