Photovoltaic devices with electroplated metal grids
One embodiment of the present invention provides a solar cell. The solar cell includes a photovoltaic structure and a front-side metal grid (300) situated above the photovoltaic structure. The front-side metal grid also includes one or more electroplated metal layers. The front- side metal grid incl...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
30.06.2016
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Subjects | |
Online Access | Get full text |
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Abstract | One embodiment of the present invention provides a solar cell. The solar cell includes a photovoltaic structure and a front-side metal grid (300) situated above the photovoltaic structure. The front-side metal grid also includes one or more electroplated metal layers. The front- side metal grid includes one or more finger lines (302, 304), and each end of a respective finger line is coupled to a corresponding end of an adjacent finger line via an additional metal line (306, 308, 314, 316, 318, 320), thus ensuring that the respective finger line has no open end. |
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AbstractList | One embodiment of the present invention provides a solar cell. The solar cell includes a photovoltaic structure and a front-side metal grid (300) situated above the photovoltaic structure. The front-side metal grid also includes one or more electroplated metal layers. The front- side metal grid includes one or more finger lines (302, 304), and each end of a respective finger line is coupled to a corresponding end of an adjacent finger line via an additional metal line (306, 308, 314, 316, 318, 320), thus ensuring that the respective finger line has no open end. |
Author | XU, ZHENG FU, JIANMING HENG, JIUNN BENJAMIN BEITEL, CHRISTOPHER J |
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Snippet | One embodiment of the present invention provides a solar cell. The solar cell includes a photovoltaic structure and a front-side metal grid (300) situated... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | Photovoltaic devices with electroplated metal grids |
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