Method of bonding a film to a curved substrate
A method of bonding a film (2) to a curved substrate (1) comprises preforming the film by applying a pneumatic pressure difference between two sides of the film and by heating said film. An intermediate shape is then conferred on the film, which is suitable for applying the film against a curved fac...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
20.10.2011
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Subjects | |
Online Access | Get full text |
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