APA (7th ed.) Citation

Son, C., Lee, J., Lee, S., Yoon, J., & Moon, C. (2019). Cooling Performance of Heat Pump with Interactive Electronic Expansion Valve. Journal of the Korean Society for Power System Engineering, 23(5), 86-92. https://doi.org/10.9726/kspse.2019.23.5.086

Chicago Style (17th ed.) Citation

Son, Chang-Hyo, Joon-Hyuk Lee, Sang-Woo Lee, Jung-In Yoon, and Choon-Geun Moon. "Cooling Performance of Heat Pump with Interactive Electronic Expansion Valve." Journal of the Korean Society for Power System Engineering 23, no. 5 (2019): 86-92. https://doi.org/10.9726/kspse.2019.23.5.086.

MLA (9th ed.) Citation

Son, Chang-Hyo, et al. "Cooling Performance of Heat Pump with Interactive Electronic Expansion Valve." Journal of the Korean Society for Power System Engineering, vol. 23, no. 5, 2019, pp. 86-92, https://doi.org/10.9726/kspse.2019.23.5.086.