Study of Miniaturization of a Silicon Vapor Chamber for Compact 3D Microelectronics, via a Hybrid Analytical and Finite Element Method
The interest in silicon vapor chambers (SVCs) has increased in the recent years as they have been identified as efficient cooling systems for microelectronics. They present the advantage of higher thermal conductivity and smaller form factor compared to conventional heat spreaders. This work aims to...
Saved in:
Published in | Journal of biomedical engineering and medical imaging Vol. 6; no. 5; pp. 1 - 18 |
---|---|
Main Authors | , , , , , , |
Format | Journal Article |
Language | English |
Published |
31.10.2019
|
Online Access | Get full text |
Cover
Loading…
Abstract | The interest in silicon vapor chambers (SVCs) has increased in the recent years as they have been identified as efficient cooling systems for microelectronics. They present the advantage of higher thermal conductivity and smaller form factor compared to conventional heat spreaders. This work aims to investigate the potential miniaturization of these devices, preliminary to integration on the backside of mobile device chips, located as close as possible to hotspots. While detailed numerical models of vapor chamber operation are developed, an easy modeling with low computational cost is needed for an effective parametric study. Based on the study of the operating limits, this paper shows the thinning potential of a water filled micropillar for a device operating below 10 W and identify the corresponding vapour core height, and wick thickness. |
---|---|
AbstractList | The interest in silicon vapor chambers (SVCs) has increased in the recent years as they have been identified as efficient cooling systems for microelectronics. They present the advantage of higher thermal conductivity and smaller form factor compared to conventional heat spreaders. This work aims to investigate the potential miniaturization of these devices, preliminary to integration on the backside of mobile device chips, located as close as possible to hotspots. While detailed numerical models of vapor chamber operation are developed, an easy modeling with low computational cost is needed for an effective parametric study. Based on the study of the operating limits, this paper shows the thinning potential of a water filled micropillar for a device operating below 10 W and identify the corresponding vapour core height, and wick thickness. |
Author | Perceval, Coudrain Abdelkader, Souifi Yue, Ma Christian, Gontrand Jean-Phulippe, Colonna Luc, Fréchette Mahmoud, Shirazy |
Author_xml | – sequence: 1 givenname: Ma surname: Yue fullname: Yue, Ma – sequence: 2 givenname: Shirazy surname: Mahmoud fullname: Mahmoud, Shirazy – sequence: 3 givenname: Coudrain surname: Perceval fullname: Perceval, Coudrain – sequence: 4 givenname: Colonna surname: Jean-Phulippe fullname: Jean-Phulippe, Colonna – sequence: 5 givenname: Souifi surname: Abdelkader fullname: Abdelkader, Souifi – sequence: 6 givenname: Fréchette surname: Luc fullname: Luc, Fréchette – sequence: 7 givenname: Gontrand surname: Christian fullname: Christian, Gontrand |
BookMark | eNqVj7FOwzAQhi3UShTalfkegAanwaYZUWnVpVMRq3VxHPUqx45sFyk8AM9NUjGwMt1_v_Td6btjE-edYewh51n-_FKsn86VaSmTIlvzQt6w2YoLscxXUk7-5Fu2iPHMOc_LshRCztj3MV3qHnwDB3KE6RLoCxN5N1YIR7Kkh-UDOx9gc8K2MgGaMfu2Q52geBtIHbyxRqfgHen4CJ-EA7zvq0A1vDq0fSKNFtDVsBv-JANba1rjEhxMOvl6zqYN2mgWv_OeZbvt-2a_HC7HGEyjukAthl7lXF2F1VVYSaFG4eLfwA-uWWIe |
ContentType | Journal Article |
DBID | AAYXX CITATION |
DOI | 10.14738/jbemi.65.8036 |
DatabaseName | CrossRef |
DatabaseTitle | CrossRef |
DatabaseTitleList | CrossRef |
DeliveryMethod | fulltext_linktorsrc |
EISSN | 2055-1266 |
EndPage | 18 |
ExternalDocumentID | 10_14738_jbemi_65_8036 |
GroupedDBID | AAYXX ALMA_UNASSIGNED_HOLDINGS CITATION M~E |
ID | FETCH-crossref_primary_10_14738_jbemi_65_80363 |
ISSN | 2055-1266 |
IngestDate | Fri Aug 23 02:57:51 EDT 2024 |
IsPeerReviewed | false |
IsScholarly | true |
Issue | 5 |
Language | English |
LinkModel | OpenURL |
MergedId | FETCHMERGED-crossref_primary_10_14738_jbemi_65_80363 |
ParticipantIDs | crossref_primary_10_14738_jbemi_65_8036 |
PublicationCentury | 2000 |
PublicationDate | 2019-10-31 |
PublicationDateYYYYMMDD | 2019-10-31 |
PublicationDate_xml | – month: 10 year: 2019 text: 2019-10-31 day: 31 |
PublicationDecade | 2010 |
PublicationTitle | Journal of biomedical engineering and medical imaging |
PublicationYear | 2019 |
SSID | ssj0001999556 |
Score | 4.280998 |
Snippet | The interest in silicon vapor chambers (SVCs) has increased in the recent years as they have been identified as efficient cooling systems for microelectronics.... |
SourceID | crossref |
SourceType | Aggregation Database |
StartPage | 1 |
Title | Study of Miniaturization of a Silicon Vapor Chamber for Compact 3D Microelectronics, via a Hybrid Analytical and Finite Element Method |
Volume | 6 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV1LS8NAEF6qXryIouKbPQgeYmrbzabtUXxQhIjgg95CNtnQSJuWkAh68Og_9P84s5smsVaoXkJYskOa-ZiZnc58Q8ixZ4c-fHtpWtwPTEsGzBRd3jBl4IugK4JOx8YGZ-fW7j1aN33er9U-K1VLWSrq_tvcvpL_aBXWQK_YJfsHzRZCYQHuQb9wBQ3DdSEd308ZoZ0ojpChM2-q1E2P99EQ1BwbTx7E2Pi_Os7-UGWFygj4qcEusWw-GZezcJRWX7BRy-i9YjOXZi1JC06B6wiDVONKV50bjhpA_UuEq1v71VZZ0h4qMdP1aKSmJBW2J9OJ8sJXON5gNM507noQJd7ba2nLEx-pylWmFx7BURdFOZD0YvNukA2jyURXOoKJj_Wc8GmKo9mt-AZlCVsNzs1my845s-es5abcriCWV8xys-Lftbn_4TmstiKKfxZyFNVtXu802ByK7hnXWRQ04lEKJbhqv2tzF_cvkZVWu8ux0tR5r6T-ICjnaq5w8SNyOlEUcfbtFSrhUiXueVgna7k66blG3wapyXiTfCjk0XFIZ5CHSx7NkUcV8miOPBrivUYeZZd0FnmnFHAHmzXuaIk7CoChGnc0xx3VuNsi9eurh4ueOX15d6LJU9z5X4ptk-V4HMsdQoVgFuuEtuAMTtMsEHjm9kUrDLjPREPukpMFhe4t_OQ-WS1xd0CW0ySThxBspuJIqe4LGKKMPg |
link.rule.ids | 315,786,790,27955,27956 |
linkProvider | ISSN International Centre |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Study+of+Miniaturization+of+a+Silicon+Vapor+Chamber+for+Compact+3D+Microelectronics%2C+via+a+Hybrid+Analytical+and+Finite+Element+Method&rft.jtitle=Journal+of+biomedical+engineering+and+medical+imaging&rft.au=Yue%2C+Ma&rft.au=Mahmoud%2C+Shirazy&rft.au=Perceval%2C+Coudrain&rft.au=Jean-Phulippe%2C+Colonna&rft.date=2019-10-31&rft.issn=2055-1266&rft.eissn=2055-1266&rft.volume=6&rft.issue=5&rft.spage=1&rft.epage=18&rft_id=info:doi/10.14738%2Fjbemi.65.8036&rft.externalDBID=n%2Fa&rft.externalDocID=10_14738_jbemi_65_8036 |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=2055-1266&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=2055-1266&client=summon |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=2055-1266&client=summon |