A Novel Light Scattering Analysis Method for Monitoring Undiluted CMP Slurry

Correlation of CMP slurry properties including large particle counts (LPC) to semiconductor manufacturing defect and yield metrics has long been a promise of proper implementation of undiluted slurry process monitoring [1]. Continuous, real-time metrology validating this correlation has now been in...

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Bibliographic Details
Published inMeeting abstracts (Electrochemical Society) Vol. MA2016-01; no. 17; p. 1037
Main Authors Fury, Michael A., Klein, Michael F., Burlison, Phil, Wakefield, Ray
Format Journal Article
LanguageEnglish
Published 01.04.2016
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