A Novel Light Scattering Analysis Method for Monitoring Undiluted CMP Slurry
Correlation of CMP slurry properties including large particle counts (LPC) to semiconductor manufacturing defect and yield metrics has long been a promise of proper implementation of undiluted slurry process monitoring [1]. Continuous, real-time metrology validating this correlation has now been in...
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Published in | Meeting abstracts (Electrochemical Society) Vol. MA2016-01; no. 17; p. 1037 |
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Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
01.04.2016
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Online Access | Get full text |
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