Low Temperature Wafer Level Bonding Techniques for MEMS Sensors
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Published in | Meeting abstracts (Electrochemical Society) Vol. MA2007-02; no. 34; p. 1546 |
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Main Authors | , |
Format | Journal Article |
Language | English |
Published |
28.09.2007
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Online Access | Get full text |
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ISSN: | 2151-2043 2151-2035 |
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DOI: | 10.1149/MA2007-02/34/1546 |