Rao, Y., Li, Y., Liu, Y., & Yang, L. (2023). Experimental and numerical studies on enhanced effusion cooling with shallowly dimpled film holes on double-wall structure surface. The International journal of heat and fluid flow, 101, 109135. https://doi.org/10.1016/j.ijheatfluidflow.2023.109135
Chicago Style (17th ed.) CitationRao, Yu, Yuan Li, Yuyang Liu, and Li Yang. "Experimental and Numerical Studies on Enhanced Effusion Cooling with Shallowly Dimpled Film Holes on Double-wall Structure Surface." The International Journal of Heat and Fluid Flow 101 (2023): 109135. https://doi.org/10.1016/j.ijheatfluidflow.2023.109135.
MLA (9th ed.) CitationRao, Yu, et al. "Experimental and Numerical Studies on Enhanced Effusion Cooling with Shallowly Dimpled Film Holes on Double-wall Structure Surface." The International Journal of Heat and Fluid Flow, vol. 101, 2023, p. 109135, https://doi.org/10.1016/j.ijheatfluidflow.2023.109135.