Dislocation micromechanisms under single slip conditions

The microstructures formed in the early stage of deformation of Cu, Al, and TiAl in single slip and at low temperatures are analysed. While dislocations are highly mobile in Cu and Al, they are subject to a significant lattice friction in TiAl. Also, they are dissociated over a few nm in Cu, not in...

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Published inInternational journal of materials research Vol. 97; no. 3; pp. 189 - 199
Main Authors Veyssière, Patrick, Chiu, Yu-Lung, Niewczas, Marek
Format Journal Article
LanguageEnglish
Published De Gruyter 11.01.2022
Subjects
Collinear junction reaction
Deformation microstructure
Prismatic loop
Single slip
Work-hardening
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Abstract The microstructures formed in the early stage of deformation of Cu, Al, and TiAl in single slip and at low temperatures are analysed. While dislocations are highly mobile in Cu and Al, they are subject to a significant lattice friction in TiAl. Also, they are dissociated over a few nm in Cu, not in Al and TiAl. These various properties are manifested in the self-organization of dislocations in bundles. The role of nanometric prismatic loops in producing specific debris is emphasized in the context of the so-called collinear interaction. Possible artefacts arising from microstructural relaxation after unloading are discussed and limitations of weak-beam analyses assessed.
AbstractList The microstructures formed in the early stage of deformation of Cu, Al, and TiAl in single slip and at low temperatures are analysed. While dislocations are highly mobile in Cu and Al, they are subject to a significant lattice friction in TiAl. Also, they are dissociated over a few nm in Cu, not in Al and TiAl. These various properties are manifested in the self-organization of dislocations in bundles. The role of nanometric prismatic loops in producing specific debris is emphasized in the context of the so-called collinear interaction. Possible artefacts arising from microstructural relaxation after unloading are discussed and limitations of weak-beam analyses assessed.
Author Veyssière, Patrick
Chiu, Yu-Lung
Niewczas, Marek
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  fullname: Veyssière, Patrick
  email: patrickv@onera.fr
  organization: LEM, CNRS-ONERA, Châtillon, France
– sequence: 2
  givenname: Yu-Lung
  surname: Chiu
  fullname: Chiu, Yu-Lung
  organization: Department of Chemical and Materials Engineering, The University of Auckland, Auckland New Zealand
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  givenname: Marek
  surname: Niewczas
  fullname: Niewczas, Marek
  organization: Department of Materials Science and Engineering, McMaster University, Hamilton, Ontario, Canada
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Snippet The microstructures formed in the early stage of deformation of Cu, Al, and TiAl in single slip and at low temperatures are analysed. While dislocations are...
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StartPage 189
SubjectTerms Collinear junction reaction
Deformation microstructure
Prismatic loop
Single slip
Work-hardening
Title Dislocation micromechanisms under single slip conditions
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Volume 97
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