刘丹, 周彩娥, 王晓婷, 吴启蒙, 张旭, 王琪琳, . . . 吴建辉. (2022). 利用集群分离分析结合高密度芯片快速定位小麦成株期抗条锈病基因YrC271. 作物学报, 48(3), 553-564. https://doi.org/10.3724/SP.J.1006.2022.11039
Chicago Style (17th ed.) Citation刘丹, et al. "利用集群分离分析结合高密度芯片快速定位小麦成株期抗条锈病基因YrC271." 作物学报 48, no. 3 (2022): 553-564. https://doi.org/10.3724/SP.J.1006.2022.11039.
MLA (9th ed.) Citation刘丹, et al. "利用集群分离分析结合高密度芯片快速定位小麦成株期抗条锈病基因YrC271." 作物学报, vol. 48, no. 3, 2022, pp. 553-564, https://doi.org/10.3724/SP.J.1006.2022.11039.
Warning: These citations may not always be 100% accurate.